The Fujimi group presented a study titled, “EHS Friendly Slurries with High Poly Si Removal Rate and Nearly Zero ILD Loss” at the 20th International Symposium on Chemical-Mechanical Planarization in August, 2016. The study was co-authored by Haiyan Li, Akira Endou, Annette Schaper, Todd Eck, Toshio Shinoda, and Anne Miller who represent a mix of researchers from Fujimi Corporation and Fujimi Incorporated.
Exhibition
Join Us at the SEMA Show 2024!
Fujimi is proud to bring our cutting-edge polish and compound technology to the Las Vegas Convention Center from Nov 4th to 8th. Visit us at