Fujimi Incorporated and Cabot Microelectronics Corporation Announce Collaboration for Advanced Slurry Development

Kiyosu, Aichi, March 29, 2018 – Fujimi Incorporated (TSE: 5384), a pioneer in the field ofmanufacturing synthetic precision abrasives as well as a leading supplier of silicon waferlapping abrasives and polishing slurries, and Cabot Microelectronics Corporation (Nasdaq:CCMP), the world’s leading supplier of chemical mechanical planarization (CMP) polishingslurries and the second largest CMP pads supplier to the semiconductor industry todayannounced plans to collaborate in the development of certain advanced CMP solutions forthe semiconductor industry. 

Fujimi Incorporated and Cabot Microelectronics believe that by working together they canleverage their respective expertise to anticipate and meet customer requirements for innovativeCMP solutions for an increasing number of advanced semiconductor applications,including those for augmented reality, artificial intelligence, automotive, high performancecomputing and 5G wireless broadband technologies. 

“We are excited to partner with Cabot Microelectronics to work to bring new technologies toan array of advanced logic and memory applications,” said Keishi Seki, President and CEOof Fujimi Incorporated. “Our planned initiative continues our dedication to the development ofbreakthrough CMP products to solve our customers’ most challenging technical problems,and we look forward to the potential for building from this base going forward.”

“I am delighted with the opportunities this initial collaboration is designed to provide for ourcustomers and respective companies,” said David Li, President and CEO of Cabot Microelectronics.“Fujimi Incorporated and Cabot Microelectronics are both leaders in materialsdevelopment, with a track record of providing high quality, leading edge CMP solutions to ourcustomers; together, I believe we are even better positioned to develop advanced CMP solutionsfor the semiconductor industry, which is experiencing unprecedented growth.”


Fujimi Incorporated, headquartered in Kiyosu, Aichi Prefecture, Japan is a pioneer in themanufacturing of synthetic precision abrasives. With a long history of excellence in precisiongrading technologies, accumulated experience and extensive research and developmentcapabilities, the Company expanded beyond abrasives for optical lenses to develop anddeliver a variety of ultraprecision products sought by leading-edge high-tech industries. Thecompany’s products include polishing abrasives for silicon wafers and other semiconductorsubstrates, various CMP products, and abrasives for computer hard disks. The company’smission is to develop new, innovative technologies and applications with a commitment toenvironmental sustainability, thereby enabling the advancement of technology for the bettermentof humanity. The company has approximately 830 employees on a global basis. Formore information about Fujimi Incorporated, visit http://www.fujimiinc.co.jp/english


Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, USA, is the world’sleading supplier of CMP polishing slurries and second largest CMP pads supplier to thesemiconductor industry. The company’s products play a critical role in the production ofadvanced semiconductor devices, helping to enable the manufacture of smaller, faster andmore complex devices by its customers. The company’s mission is to create value by deliveringhigh-performing and innovative solutions that solve its customers’ challenges. Thecompany has approximately 1,150 employees on a global basis. For more information aboutCabot Microelectronics Corporation, visit www.cabotcmp.com.


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