Fujimi Corporation Presents at ICPT 2013

Dr. Jie Lin of Research & Development, presented a poster at the 10th International Conference on Planarization/CMP Technology, ICPT 2013 (Oct. 30 to Nov. 1, 2013 in Hsinchu, Taiwan).  Titled “Effect of Pad Hardness on Planarization Efficiency of Selected Features in Cu CMP”, it is co-authored by Jie Lin and Charles Poutasse.

ICPT is the annual conference covering all aspects of Chemical-Mechanical Planarization (CMP).  ICPT was founded by a co-operation of the CMP Users Groups of Europe, Japan, Korea, Taiwan and the United States.  The next conference, ICPT2014, will be held in Kobe, Japan on November 19-21, 2014.

Below are links to the presentation and poster.


Related Posts


Visit Us at ECTC 2023!

Visit the Fujimi booth on May 31st and June 1st at the 2023 Electronic Components and Technology Conference (ECTC) in Orlando, FL to learn about

Read More »