Exhibition
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Visit the Fujimi booth on Sep 10th thru 14th at the Automechanika Frankfurt 2024 in Frankfurt, Germany to learn about our polishes and compounds for
August 20, 2024
Dr. Jie Lin of Research & Development, presented a poster at the 10th International Conference on Planarization/CMP Technology, ICPT 2013 (Oct. 30 to Nov. 1, 2013 in Hsinchu, Taiwan). Titled “Effect of Pad Hardness on Planarization Efficiency of Selected Features in Cu CMP”, it is co-authored by Jie Lin and Charles Poutasse.
ICPT is the annual conference covering all aspects of Chemical-Mechanical Planarization (CMP). ICPT was founded by a co-operation of the CMP Users Groups of Europe, Japan, Korea, Taiwan and the United States. The next conference, ICPT2014, will be held in Kobe, Japan on November 19-21, 2014.
Below are links to the presentation and poster.
Visit the Fujimi booth on Sep 10th thru 14th at the Automechanika Frankfurt 2024 in Frankfurt, Germany to learn about our polishes and compounds for
Visit the Fujimi booth on May 29th and 30th at the 2024 Electronic Components and Technology Conference (ECTC) Exhibition in Denver, CO to learn about
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