News
Visit us at the SEMA Show 2023
We are thrilled to announce that Fujimi is gearing up for the prestigious SEMA Show 2023! Get ready to witness our latest innovations, cutting-edge technology,
October 25, 2023
Dr. Jie Lin of Research & Development, presented a poster at the 10th International Conference on Planarization/CMP Technology, ICPT 2013 (Oct. 30 to Nov. 1, 2013 in Hsinchu, Taiwan). Titled “Effect of Pad Hardness on Planarization Efficiency of Selected Features in Cu CMP”, it is co-authored by Jie Lin and Charles Poutasse.
ICPT is the annual conference covering all aspects of Chemical-Mechanical Planarization (CMP). ICPT was founded by a co-operation of the CMP Users Groups of Europe, Japan, Korea, Taiwan and the United States. The next conference, ICPT2014, will be held in Kobe, Japan on November 19-21, 2014.
Below are links to the presentation and poster.
We are thrilled to announce that Fujimi is gearing up for the prestigious SEMA Show 2023! Get ready to witness our latest innovations, cutting-edge technology,
Visit the Fujimi booth on May 31st and June 1st at the 2023 Electronic Components and Technology Conference (ECTC) in Orlando, FL to learn about
Copyright © 2022. All rights reserved.
