Clarkson University Center for Advanced Materials Processing Organizes 18th Annual International Symposium on Chemical-Mechanical Planarization

Source:  Clarkson University Press Release – 9/4/2013

More than 100 researchers from several high- technology companies, including Fujimi staff, suppliers and universities from the United States, Japan, Korea, China, Taiwan, Belgium, and Canada, gathered in Lake Placid, N.Y., in August for the 18th International Symposium on Chemical-Mechanical Planarization (CMP), sponsored by Clarkson University’s Center for Advanced Materials Processing (CAMP).

Read more on the CAMP Symposium here.

Share

Related Posts

News

Visit Us at ECTC 2023!

Visit the Fujimi booth on May 31st and June 1st at the 2023 Electronic Components and Technology Conference (ECTC) in Orlando, FL to learn about

Read More »