May 2019 Fujimi Corporation has been recognized by Portland General Electric (PGE) for making a positive impact in our community through participation in PGE’s Energy Partner Program. Through Fujimi’s shifting of energy load during peak consumption times, we were able to contribute to a total of 13.5 Megawatt in electrical savings achieved by this program. […]
Fujimi is a recognized leader in CMP polishing slurries and lapping solutions to the semiconductor market. Today, Fujimi would like to announce the arrival of Dr. Shinya Hirano, Product Development Scientist, to head the Fujimi Center of Excellence for SiC wafer polishing at Fujimi Corporation in March 2019. Hirano-san received his PhD at the Graduate […]
Fujimi is a recognized leader in CMP polishing slurries and lapping solutions to the semiconductor market. Today, Fujimi would like to announce that we have established a HVM site for silicon carbide (SiC) wafer polishing slurries at our Tualatin, Oregon, USA facility. Leveraging our cumulative knowledge in research and development and expertise in precision manufacturing, […]
Kiyosu, Aichi, March 29, 2018 – Fujimi Incorporated (TSE: 5384), a pioneer in the field ofmanufacturing synthetic precision abrasives as well as a leading supplier of silicon waferlapping abrasives and polishing slurries, and Cabot Microelectronics Corporation (Nasdaq:CCMP), the world’s leading supplier of chemical mechanical planarization (CMP) polishingslurries and the second largest CMP pads supplier to the […]
FUJIMI –Introducing POLIPLA to the Americas Press Release Date: July 17, 2017 Fujimi is an independent slurry manufacturer with over 30 years of experience producing plastic lens polish for the European and Asian markets. Fujimi is excited to announce that POLIPLA, a premium series of plastic lens slurries will be offered to the American markets. Fujimi […]
Hooi-Sung (Brian) Kim, PhD at Fujimi Corporation presented a study titled, “The Impact of Sample Containers on Large Particle Count for CMP Slurries”, at the 2017 CMPUG Spring Meeting. The presentation highlighted the contribution of sample bottle lid liners to increased LPC counts in CMP slurries. The presentation material can be downloaded here.
Fujimi Corporation’s Senior Product Development Chemist, Dr. Jie Lin, presented a paper at China Semiconductor Technology International Conference, CSTIC 2017 (March 12-13 in Shanghai, China). The paper is titled “Settling of Colloidal Silica Particles in CMP Slurry: Monitoring, Effect, and Handling”, co-authored by Jie Lin and W. Scott Rader.
The Fujimi group presented a study titled, “EHS Friendly Slurries with High Poly Si Removal Rate and Nearly Zero ILD Loss” at the 20th International Symposium on Chemical-Mechanical Planarization in August, 2016. The study was co-authored by Haiyan Li, Akira Endou, Annette Schaper, Todd Eck, Toshio Shinoda, and Anne Miller who represent a mix of researchers from […]
Fujimi Corporation’s Jimmy Granstrom and Hisashi Takeda presented a paper at the Twentieth International Symposium on Chemical-Mechanical Planarization, hosted by CAMP in Lake Placid, New York August 7-10 2016. The research paper, titled “>Copper Corrosion Suppression For Advanced Nodes In Ruthenium Barrier Chemical Mechanical Polishing“, was presented on August 8
Visit Fujimi in Washington DC on May 22-26 at 2016 TechConnect to learn more about our new mesoporous materials and silane coated alumina particles. Can’t make it to the expo? Contact us with your questions at NBD@fujimi.com. http://www.techconnectworld.com/World2016
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