PLANERLITE 8000 SERIES – Barrier CMP Slurry

Fujimi’s PLANERLITE 8000 series of CMP polishing slurries are designed specifically for barrier metal in the Copper (Cu) interconnection.

Based on ultra purity colloidal silica with special additives, it delivers enough barrier metal removal rate with planarity to be kept by designed selectivity. Also, it delivers minimal scratch and minimal roughness, as ideal polishing slurry.

Category CMP (Chemical Mechanical Planarization)

ApplicationBarrier Metal Polish, Chemical Mechanical Planarization (Cmp)

TypeSlurry

Material Colloidal Silica

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Fujimi’s global network is designed to meet the demands of our customers and provide the highest quality of materials and support available. Our network consists of Fujimi Incorporated, located in Japan, and its four subsidiaries strategically located around the globe.

PLANERLITE 8000 SERIES – Barrier CMP Slurry

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