PLANERLITE 8000 SERIES – CMP Slurry

Fujimi’s PLANERLITE 8000 series of CMP polishing slurries are designed specifically for barrier metal in the Copper (Cu) interconnection.

Based on ultra purity colloidal silica with special additives, it delivers enough barrier metal removal rate with planarity to be kept by designed selectivity.  Also, it delivers minimal scratch and minimal roughness, as ideal polishing slurry.

TypeSlurry