PLANERLITE 8000 SERIES – CMP Slurry

Fujimi’s PLANERLITE 8000 series of CMP polishing slurries are designed specifically for barrier metal in the Copper (Cu) interconnection.

Category CMP (Chemical Mechanical Planarization)

ApplicationBarrier Metal Polish, Chemical Mechanical Planarization (Cmp)

TypeSlurry

Material Colloidal Silica

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Fujimi’s global network is designed to meet the demands of our customers and provide the highest quality of materials and support available. Our network consists of Fujimi Incorporated, located in Japan, and its four subsidiaries strategically located around the globe.

PLANERLITE 8000 SERIES – CMP Slurry

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