PLANERLITE 7000 SERIES – Cu CMP Slurry

Fujimi’s PLANERLITE 7000 series of CMP polishing slurries are designed specifically for Copper (Cu) metallization in the damascene process.

Based on ultra high purity colloidal silica with special additives, it delivers high copper removal rate, with excellent selectivity to barrier metal.  As a result, erosion is low and residual copper on the barrier metal is minimal, making it possible to completely stable, with no sedimentation, and minimal scratching.  We also offer a high-dilution type, contributing to lower cost for copper damascene process.