PLANERLITE 7000 SERIES – CMP Slurry

Fujimi’s PLANERLITE 7000 series of CMP polishing slurries are designed specifically for Copper (Cu) metallization in the damascen process.

Category CMP (Chemical Mechanical Planarization)

ApplicationChemical Mechanical Planarization (Cmp), Copper (Cu) Damascene, Copper (Cu) Polish

TypeSlurry

Material Colloidal Silica

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Fujimi’s global network is designed to meet the demands of our customers and provide the highest quality of materials and support available. Our network consists of Fujimi Incorporated, located in Japan, and its four subsidiaries strategically located around the globe.

PLANERLITE 7000 SERIES – CMP Slurry

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