PLANERLITE 6000 SERIES – CMP Slurry

Fujimi’s PLANERLITE 6000 series of CMP polishing slurries are designed for use on polysilicon applications.

There is a variety of types available, either polishing slurry based on ultra-high purity colloidal silica or rinsing agent with special additives which keeps post-polishing wafer surface hydrophilic.  The polishing slurry, in all types has extremely high polysilicon removal rate with excellent selectivity to silicon oxide film.  The rinsing agent helps prevent particle adhesion, simplifying wafer cleaning process.  The entire line can be used at high dilutions, and adjustment of the dilution provides control of removal rate and selectivity while also delivering high cost/ performance.  Abrasive particles are completely dispersed, eliminating sedimentation in a high stable slurry.

TypeSlurry