Fujimi’s PLANERLITE 4000 series of CMP polishing slurries are designed for use on SiO2 films (interlayer dielectric/ILD, shallow trench isolation/STI).
Based on ultra-high purity colloidal silica or fumed silica, it is available in several grades with varying additives and abrasive particle concentration, enabling users to select the product optimal for their specific process parameters and cost/ performance requirements.
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